In excimer and femtosecond laser processing, very high quantum energy is induced into the workpiece, exceeding the energy among atoms, permitting each molecule to be decomposed into atoms, which are removed from the workpiece. The great advantage of this method, in contrast with the previous methods, is that the developed heat-affected layer is very small. This particular feature of these processes allows for performing very accurate cutting surfaces almost without defects. Their main disadvantages are the low machining speed and, thus, the low efficiency and the high cost of the required equipment.